Revolutionizing AI Semiconductor Processing: A Breakthrough in Nanotechnology
The future of smartphones and AI services hinges on the precision of semiconductor processing. Researchers at the Korea Advanced Institute of Science and Technology (KAIST) have made a groundbreaking discovery, pushing the boundaries of nanotechnology. They've developed a novel technique that utilizes carbon nanotubes, thinner than a human hair, as an innovative abrasive material, revolutionizing semiconductor surface processing.
On February 11th, KAIST announced a significant advancement in semiconductor technology. A research team led by Professor Sanha Kim from the Department of Mechanical Engineering has created a 'nano sandpaper' that employs carbon nanotubes, an astonishingly thin abrasive material. This breakthrough not only enhances precision but also reduces environmental impact during fabrication, offering a novel planarization technique.
Traditional sandpaper, while effective for smoothing surfaces, presents challenges in semiconductor manufacturing due to its difficulty in uniformly securing extremely fine particles. To address this, the semiconductor industry has adopted chemical mechanical polishing (CMP), a planarization process using chemical slurries. However, CMP's complexity and environmental impact have prompted the search for more sustainable solutions.
The research team's innovative approach involves vertically aligning carbon nanotubes, fixing them within polyurethane, and partially exposing them on the surface, creating a 'nano sandpaper.' This structure ensures structural stability, preventing abrasive detachment and minimizing surface damage. The nano sandpaper boasts an extraordinary abrasive density, surpassing that of the finest commercially available sandpaper by a factor of 500,000.
Experiments confirmed the nano sandpaper's effectiveness. It polished rough copper surfaces to a nanometer-level smoothness and significantly reduced dishing defects in semiconductor pattern planarization, up to 67% compared to conventional CMP processes. Dishing defects, a critical issue in advanced semiconductors like HBM, occur when interconnect lines' centers become recessed, impacting performance and reliability.
A key advantage of the nano sandpaper is its fixed abrasive materials, eliminating the need for continuous slurry solution supply. This reduction in cleaning steps and waste slurry suggests a more environmentally friendly semiconductor manufacturing process.
The research team envisions broad applications, including advanced semiconductor planarization in AI servers and hybrid bonding processes. By extending the concept of sandpaper to nano-precision processing, they've secured core technologies for semiconductor manufacturing.
Professor Sanha Kim emphasized the study's significance, stating that it demonstrates the everyday concept of sandpaper can be extended to the nanoscale for ultra-fine semiconductor manufacturing. The team's work not only enhances semiconductor performance but also promotes environmentally friendly manufacturing processes.
Dr. Sukkyung Kang, a mechanical engineering expert, contributed significantly to this research, earning the Gold Prize in the Mechanical Engineering Division at the 31st Samsung Human Tech Paper Award. The findings were published in the international journal Advanced Composites and Hybrid Materials on January 8, 2026, with a DOI: https://doi.org/10.1007/s42114-025-01608-3.
This research was supported by various grants, including the National Research Foundation of Korea, Glocal Lab Program, InnoCORE Program, and KAIST Jump-Up Research Program.
This breakthrough in nanotechnology not only promises improved semiconductor performance but also paves the way for a more sustainable and environmentally conscious future in semiconductor manufacturing.
